Description
Características principais
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1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
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2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
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3. 6 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x4 (in x8 slot)
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4. 8 Hot-swap 3.5″ drive bays
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5. 2x 10GBase-T LAN ports via Intel X550
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6. 1 VGA, 2 COM, 5 USB 3.0
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7. 4 Heavy duty fans, 4 exhaust fans, and 2 active heatsink with optimal fan speed control
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8. 2200W Redundant Power Supplies Titanium Level (96%)
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9. GPU Kit for passive GPU/Coprocessor support (MCP-320-74701-0N-KIT)
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